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High-Dynamic-Range, Direct Up-/Downconversion
1500MHz to 2500MHz Quadrature Mod/Demod
ABSOLUTE MAXIMUM RATINGS
VCC_ to GND ........................................................-0.3V to +5.5V
BBI+, BBI-, BBQ+, BBQ- to GND..................-4V to (V CC + 0.3V)
LO, RF to GND Maximum Current ......................................30mA
RF Input Power ...............................................................+30dBm
Baseband Differential I/Q Input Power ..........................+20dBm
LO Input Power...............................................................+10dBm
RBIASLO1 Maximum Current .............................................10mA
RBIASLO2 Maximum Current .............................................10mA
RBIASLO3 Maximum Current .............................................10mA
Continuous Power Dissipation (Note 1) ...............................7.6W
Operating Case Temperature Range (Note 2) ....-40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1:
Note 2:
Based on junction temperature T J = T C + ( θ JC x V CC x I CC ). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150°C.
T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS
TQFN
Junction-to-Ambient
Thermal Resistance ( θ JA ) (Notes 3, 4) .......................+34°C/W
Junction-to-Case
Thermal Resistance ( θ JC ) (Notes 1, 4) ......................+8.5°C/W
Note 3:
Note 4:
Junction temperature T J = T A + ( θ JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
DC ELECTRICAL CHARACTERISTICS
(MAX2023 Typical Application Circuit, V CC = 4.75V to 5.25V, GND = 0V, I/Q inputs terminated into 50 Ω to GND, LO input terminated into
50 Ω , RF output terminated into 50 Ω , 0V common-mode input, R1 = 432 Ω , R2 = 562 Ω , R3 = 301 Ω , T C = -40°C to +85°C, unless otherwise
noted. Typical values are at V CC = 5V, T C = +25°C, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
(Note 5)
CONDITIONS
MIN
4.75
255
TYP
5.00
295
MAX
5.25
345
UNITS
V
mA
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER
RF Frequency (Note 6)
LO Frequency (Note 6)
SYMBOL
f RF
f LO
CONDITIONS
MIN
1500
1500
TYP
MAX
2500
2500
UNITS
MHz
MHz
IF Frequency (Note 6)
f IF
1000
MHz
LO Power Range
P LO
-3
+3
dBm
2
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